rus
Issue #7/2013
V.Tyulpanov, A.Vasilyev
Assemblage of Integrated Circuits by 3D-integration Technology
Assemblage of Integrated Circuits by 3D-integration Technology
One of the main trends in microelectronics is diminution of the dimensions of products with a simultaneous increase of their productivity and functionality. This task is being successfully solved by the method of a 3D arrangement of the constituent elements of the integrated circuits. The most intensively developed methods of 3D-integration, which means assemblage of products, beginning from semiconductor wafers – 3D-WLSiP up to the stage of packing of crystals in a case. The modern technologies allow us to fix crystals on a wafer and wafers to each other, obtaining a finished product even before partition of the wafers
into separate crystals.
into separate crystals.
Теги: 3d arrangement 3d-integration 3d-интеграция integrated circuits интегральные схемы трехмерная компоновка
One of the main trends in microelectronics is diminution of the dimensions of products with a simultaneous increase of their productivity and functionality. This task is being successfully solved by the method of a 3D arrangement of the constituent elements of the integrated circuits. The most intensively developed methods of 3D-integration, which means assemblage of products, beginning from semiconductor wafers – 3D-WLSiP up to the stage of packing of crystals in a case. The modern technologies allow us to fix crystals on a wafer and wafers to each other, obtaining a finished product even before partition of the wafers
into separate crystals.
into separate crystals.
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