rus
The Zelenograd company Epiel is a leading Russian manufacturer of epitaxial structures. The company was founded in 1998 by specialists of Material Research Institute, Mikron factory and Research Institute of Precision Machine Manufacturing in the premises of the epitaxy department Mikron. Upgrading the equipment, introducing state-of-the-art technologies and proprietary know-how made it possible for Epiel to master the production of epitaxial structures the quality of which is not inferior to the best rival products in the world. For over 15 years the company successfully meets the needs of the Russian microelectronics industry in epitaxial structures. More than 50 enterprises in the microelectronic sector in Russia and abroad are the consumers of Epiel’s products. Andrey Babayev, head of the company’s marketing and business development department, told about the technological capabilities, products and plans of the company.
What are the core competencies of the Epiel?
Our focus is on the creation of epitaxial structures on silicon and sapphire substrates by the chemical vapour deposition (CVD). We use the equipment made by leading European companies. The reactors of both vertical and horizontal types are used. Epitaxial structures are produced on our substrates with a diameter from 76 to 200 mm, and on the customer wafers. We mainly buy silicon wafers abroad but also some in Russia.
Our silicon epitaxial structures are used in the manufacture of integrated circuits, diodes and transistors of various types for the equipment for civil and special purposes. Epitaxial structures on sapphire are used in the manufacture of tensor-modules used in high-precision pressure sensors, and integrated circuits for special purposes, such as radiation-resistant ICs for aerospace and defence technologies as well as for the nuclear industry.
How competitive are the company’s products in domestic and international markets?
We produce high-quality epitaxial structures the parameters of which comply with the SEMI international standards. The Quality Management System is certified for compliance with ISO 9001:2008 standard. At the same time, in the context of weakening of the rouble against the euro and dollar we can offer products to overseas customers at very attractive prices.
A key advantage of our company is the possibility of producing epitaxial structures with special features. Major foreign competitors tend to refuse such orders while we have the necessary competencies and technological capabilities required for the production of small batches. In particular, we can manufacture ultra high-ohmic structures with undoped epitaxial layers for PIN diodes and radiation sensors, ultra thick epitaxial structures for power electronics and silicon structures with dielectric isolation, multilayer epitaxial structures for specific discrete devices, epitaxial structures with a variable doping profile for double-diffused MOS transistors and power transistors. Flexible adjustment of the epitaxial growth process parameters to obtain the desired structure specifications is one of our know-how and, at the same time, a promising area of business, as the non-standard products will have a higher added value.
What types of products are most in demand in Russia?
First of all, epitaxial structures with a diameter of 100 mm and 150 mm. The production of epitaxial structures with a diameter of 200 mm was developed for orders of Mikron factory and in the future for Angstrem-T, the production of which is going to be commissioned in mid-2016.
What are the company’s business development plans?
We have gained a strong position in the Russian market and are now striving to attract more foreign orders, especially since the economic situation is quite favourable. For this purpose, an agreement was reached with the German company Maicom Quarz, which has become the exclusive distributor of our epitaxial structures in the EU. Until now, we have mainly supplied overseas small-batch products but also plan to attract orders for larger series. Of course, this requires the appropriate capacities; thus we are expanding our production facilities, in particular, we add more equipment to a new area launched two years ago. We are also constantly improving technical level, developing new solutions; our analysis and technology development laboratory works effectively and conducts research.
What are the core competencies of the Epiel?
Our focus is on the creation of epitaxial structures on silicon and sapphire substrates by the chemical vapour deposition (CVD). We use the equipment made by leading European companies. The reactors of both vertical and horizontal types are used. Epitaxial structures are produced on our substrates with a diameter from 76 to 200 mm, and on the customer wafers. We mainly buy silicon wafers abroad but also some in Russia.
Our silicon epitaxial structures are used in the manufacture of integrated circuits, diodes and transistors of various types for the equipment for civil and special purposes. Epitaxial structures on sapphire are used in the manufacture of tensor-modules used in high-precision pressure sensors, and integrated circuits for special purposes, such as radiation-resistant ICs for aerospace and defence technologies as well as for the nuclear industry.
How competitive are the company’s products in domestic and international markets?
We produce high-quality epitaxial structures the parameters of which comply with the SEMI international standards. The Quality Management System is certified for compliance with ISO 9001:2008 standard. At the same time, in the context of weakening of the rouble against the euro and dollar we can offer products to overseas customers at very attractive prices.
A key advantage of our company is the possibility of producing epitaxial structures with special features. Major foreign competitors tend to refuse such orders while we have the necessary competencies and technological capabilities required for the production of small batches. In particular, we can manufacture ultra high-ohmic structures with undoped epitaxial layers for PIN diodes and radiation sensors, ultra thick epitaxial structures for power electronics and silicon structures with dielectric isolation, multilayer epitaxial structures for specific discrete devices, epitaxial structures with a variable doping profile for double-diffused MOS transistors and power transistors. Flexible adjustment of the epitaxial growth process parameters to obtain the desired structure specifications is one of our know-how and, at the same time, a promising area of business, as the non-standard products will have a higher added value.
What types of products are most in demand in Russia?
First of all, epitaxial structures with a diameter of 100 mm and 150 mm. The production of epitaxial structures with a diameter of 200 mm was developed for orders of Mikron factory and in the future for Angstrem-T, the production of which is going to be commissioned in mid-2016.
What are the company’s business development plans?
We have gained a strong position in the Russian market and are now striving to attract more foreign orders, especially since the economic situation is quite favourable. For this purpose, an agreement was reached with the German company Maicom Quarz, which has become the exclusive distributor of our epitaxial structures in the EU. Until now, we have mainly supplied overseas small-batch products but also plan to attract orders for larger series. Of course, this requires the appropriate capacities; thus we are expanding our production facilities, in particular, we add more equipment to a new area launched two years ago. We are also constantly improving technical level, developing new solutions; our analysis and technology development laboratory works effectively and conducts research.
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