rus
Issue #1/2016
A.Stamm
Plasma technologies for synthesis of structures for micro- and nanoelectronics
Plasma technologies for synthesis of structures for micro- and nanoelectronics
Oxford Instruments is one of the world›s leading developers and manufacturers of equipment for nanotechnology. The company whose annual revenue in the 2014/2015 financial year amounted to 385 million pounds offers equipment for development and production of microelectronics for a wide range of tasks in special and consumer electronics, chemicals and oils, biotechnology, energy, mining, food industry and other industries. Key technology areas include plasma and ion-beam etch processes and deposition processes for synthesis of micro- and nanostructures. Oxford Instruments manufactures equipment for atomic layer deposition (ALD), chemical vapor deposition (CVD), inductively coupled plasma etching, ion-beam deposition (IBD) and etching (IBE), plasma enhanced chemical vapour deposition (PECVD), physical vapour deposition (PVD), reactive ion etching (RIE). More about Oxford Instruments Plasma Technology tells director of sales in Europe Andreas Stamm.
Mr. Stamm, what are the trends in the development of plasma technologies for thin film deposition and etching?
The main driver for the development of thin-film technologies remains a classic microelectronics, however, the range of applications of different methods of deposition and etching is constantly expanding. For example, MEMS, photovoltaics, photonics, biology and medicine have become increasingly important. Plasma etching is the most in-demand technology in the market, and the atomic layer deposition shows the best growth dynamics.
Main technical trends are driven by customer requirements, which can be divided into two groups: speeding-up of processes and improving the accuracy. The first group is more typical for industrial enterprises engaged in large-scale and mass production, the second is typical for research centers and R&D departments of companies. We are working in both areas, paying attention to the increase of rate and precision of deposition and etching of thin films both in laboratory equipment and in highly automated cluster systems for the industry.
How do you assess the positions of Oxford Instruments in major market segments?
Our company works in the field of thin-film technologies for about 45 years, being one of the pioneers of this market, which provided us with a great handicap, as most of competitors have less experience. In the segments of equipment for plasma etching and PECVD for R&D our market share is about 40–50%, in the segment of solutions for ALD and atomic layer etching the market share is up to 20%.
In the program of SEMICON Europa 2015 a special attention was paid to the ALD, how do you assess the prospects in this field?
This technology provides the deposition and etching of ultra-thin films of a very wide range of materials, including oxides, fluorides, nitrides, sulfides, metals, hybrid compounds, with very precise process control. ALD is successfully used for thin film deposition in such applications as high-k gate oxides, storage capacitor dielectrics, passivation layers for OLEDs and crystal silicon solar cells, adhesive layers, organic semiconductors, high aspect ratio diffusion barriers for Cu interconnects and in many other tasks. It is important that this principle can be used not only for the deposition of monoatomic films, but also for removal of the surface layer. In the latter case the technology is called atomic layer etching (ALEt). This new etching technology has very good prospects in the semiconductor industry, due to the continued reduction of node size and the development of three-dimensional structures requiring precise control of thickness of the films. We produce the ALD systems for industrial production and scientific applications.
Who represents Oxford Instruments Plasma Technology in Russia?
Technoinfo Ltd represents our solutions in the field of plasma technology in Russian market. For the last several years, over 100 pieces of equipment was installed, but now the political situation interferes with business. I really hope that this is a temporary factor, and the technological cooperation between Europe and Russia will be restored in full.
Mr. Stamm, what are the trends in the development of plasma technologies for thin film deposition and etching?
The main driver for the development of thin-film technologies remains a classic microelectronics, however, the range of applications of different methods of deposition and etching is constantly expanding. For example, MEMS, photovoltaics, photonics, biology and medicine have become increasingly important. Plasma etching is the most in-demand technology in the market, and the atomic layer deposition shows the best growth dynamics.
Main technical trends are driven by customer requirements, which can be divided into two groups: speeding-up of processes and improving the accuracy. The first group is more typical for industrial enterprises engaged in large-scale and mass production, the second is typical for research centers and R&D departments of companies. We are working in both areas, paying attention to the increase of rate and precision of deposition and etching of thin films both in laboratory equipment and in highly automated cluster systems for the industry.
How do you assess the positions of Oxford Instruments in major market segments?
Our company works in the field of thin-film technologies for about 45 years, being one of the pioneers of this market, which provided us with a great handicap, as most of competitors have less experience. In the segments of equipment for plasma etching and PECVD for R&D our market share is about 40–50%, in the segment of solutions for ALD and atomic layer etching the market share is up to 20%.
In the program of SEMICON Europa 2015 a special attention was paid to the ALD, how do you assess the prospects in this field?
This technology provides the deposition and etching of ultra-thin films of a very wide range of materials, including oxides, fluorides, nitrides, sulfides, metals, hybrid compounds, with very precise process control. ALD is successfully used for thin film deposition in such applications as high-k gate oxides, storage capacitor dielectrics, passivation layers for OLEDs and crystal silicon solar cells, adhesive layers, organic semiconductors, high aspect ratio diffusion barriers for Cu interconnects and in many other tasks. It is important that this principle can be used not only for the deposition of monoatomic films, but also for removal of the surface layer. In the latter case the technology is called atomic layer etching (ALEt). This new etching technology has very good prospects in the semiconductor industry, due to the continued reduction of node size and the development of three-dimensional structures requiring precise control of thickness of the films. We produce the ALD systems for industrial production and scientific applications.
Who represents Oxford Instruments Plasma Technology in Russia?
Technoinfo Ltd represents our solutions in the field of plasma technology in Russian market. For the last several years, over 100 pieces of equipment was installed, but now the political situation interferes with business. I really hope that this is a temporary factor, and the technological cooperation between Europe and Russia will be restored in full.
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