rus
SUSS MicroTec is a global leader in solutions for micro- and nano-structuring on the semiconductor wafers. The company, which was established in 1949 in Germany, more than 50 years bore the name of the founder, Karl Süss, and in 2001 got its present name. Factories in Germany, Switzerland and the USA produce equipment for coating, exposure, developing, wafer bonding and debonding, micro – and nanoimprinting, laser processing, plasma treatment and other steps of wafer processing. The company’s portfolio includes both automated equipment, including modular cluster systems, and the devices with manual control. Thilo Semperowitsch, account manager sales for EMEA, told about the positioning and benefits of solutions of the company.
Mr. Semperowitsch, what is the position of SUSS MicroTec in the semiconductor industry and what is the structure of the business?
We are one of the leaders in the development and manufacture of equipment for wafer processing. More than 65 years of experience, close cooperation with leading research centers, among which IMEC (Belgium), Fraunhofer IZM (Germany) and ITRI (Taiwan), as well as focus on innovative trends create a basis for our leadership. The largest companies of semiconductor industry, including Infineon, IBM, Motorola, Siemens, Philips and others, use our equipment.
The structure of the company consists of three divisions specializing in photomask equipment, lithography and substrate bonder. The share of lithography systems is more than 75% of orders. Sales in 2015 amounted to 148.5 million euros, that for more than 3 million euros higher than in previous year. The East Asian market provides more than half of revenue, about a quarter is the share of the European market.
Which segments of the market are most promising from your point of view?
It may be noted three such segments: 3D integration and advanced packaging; MEMS; optoelectronic devices, primarily LEDs.
3D integration is an area of development of semiconductor devices, which is in its infancy. The advantages of 3D architecture, in particular, smaller footprint, reduced energy consumption, improved performance, reduced costs, create conditions for its successful growth. However, for the present the industry uses mainly compromise solutions, the so-called 2.5D technologies, for example, combining of several devices on an interposer. We develop and manufacture equipment for the basic processes of 3D and 2.5D integration, such as lithography systems, which may be used for creation of redistribution layer (RDL), laser systems for manufacturing vias in interposers, temporary wafer bonding and debonding devices, etc.
3D and 2.5D integration is becoming more widely used in the manufacture of MEMS for consumer and industrial electronics, automotive, medical equipment, aerospace and other industries. If in 2015 the MEMS market was estimated at 12.5 billion dollars, it is expected that in 2020 it will exceed 21 billion dollars. Our company is one of the pioneers in the development and manufacture of process equipment for the production of MEMS. We offer automatic lithography systems, coating, alignment, exposure and development devices, the systems for wafer bonding and debonding. These types of equipment and nanoimprinting systems can successfully used also in the production of LEDs on silicon basis.
It should be noted that all three key areas are focused on the rapidly growing markets of personal electronic devices, lighting, internet of things, etc.
How important for the company is the Russian market?
Our equipment is used by leading Russian companies, among which Zelenograd nanotechnology center, Technology center MIET (Zelenograd), Kvant (Moscow), Svetlana-Rost (St. Petersburg), Istok (Fryazino), Salut (Nizhny Novgorod) and many other industrial and research organizations. We believe in the potential of the Russian market and appreciate the cooperation with our distributor, TBS.
Mr. Semperowitsch, what is the position of SUSS MicroTec in the semiconductor industry and what is the structure of the business?
We are one of the leaders in the development and manufacture of equipment for wafer processing. More than 65 years of experience, close cooperation with leading research centers, among which IMEC (Belgium), Fraunhofer IZM (Germany) and ITRI (Taiwan), as well as focus on innovative trends create a basis for our leadership. The largest companies of semiconductor industry, including Infineon, IBM, Motorola, Siemens, Philips and others, use our equipment.
The structure of the company consists of three divisions specializing in photomask equipment, lithography and substrate bonder. The share of lithography systems is more than 75% of orders. Sales in 2015 amounted to 148.5 million euros, that for more than 3 million euros higher than in previous year. The East Asian market provides more than half of revenue, about a quarter is the share of the European market.
Which segments of the market are most promising from your point of view?
It may be noted three such segments: 3D integration and advanced packaging; MEMS; optoelectronic devices, primarily LEDs.
3D integration is an area of development of semiconductor devices, which is in its infancy. The advantages of 3D architecture, in particular, smaller footprint, reduced energy consumption, improved performance, reduced costs, create conditions for its successful growth. However, for the present the industry uses mainly compromise solutions, the so-called 2.5D technologies, for example, combining of several devices on an interposer. We develop and manufacture equipment for the basic processes of 3D and 2.5D integration, such as lithography systems, which may be used for creation of redistribution layer (RDL), laser systems for manufacturing vias in interposers, temporary wafer bonding and debonding devices, etc.
3D and 2.5D integration is becoming more widely used in the manufacture of MEMS for consumer and industrial electronics, automotive, medical equipment, aerospace and other industries. If in 2015 the MEMS market was estimated at 12.5 billion dollars, it is expected that in 2020 it will exceed 21 billion dollars. Our company is one of the pioneers in the development and manufacture of process equipment for the production of MEMS. We offer automatic lithography systems, coating, alignment, exposure and development devices, the systems for wafer bonding and debonding. These types of equipment and nanoimprinting systems can successfully used also in the production of LEDs on silicon basis.
It should be noted that all three key areas are focused on the rapidly growing markets of personal electronic devices, lighting, internet of things, etc.
How important for the company is the Russian market?
Our equipment is used by leading Russian companies, among which Zelenograd nanotechnology center, Technology center MIET (Zelenograd), Kvant (Moscow), Svetlana-Rost (St. Petersburg), Istok (Fryazino), Salut (Nizhny Novgorod) and many other industrial and research organizations. We believe in the potential of the Russian market and appreciate the cooperation with our distributor, TBS.
Readers feedback
