rus
Issue #8/2016
V.Konovalov, V.Koniakhin, S.Brazhnikov
Up-to-date small scale integration chips for space applications
Up-to-date small scale integration chips for space applications
This article describes two series of small-scale integration chips developed on the basis of 5529ТР015 gate array: a family of standard logic multifunctional ICs and a series of digital-analog ICs for LVDS and LVDM differential communication line.
Small-scale integration chips for over 30 years has been widely used as key components in the design of digital devices. At present, however, their application in digital devices have declined significantly. FPGA, microcontrollers, signal processors and other specialized chips that allow to create much more sophisticated and technically more complex products, replaced the small-scale integration chips.
A problem often encountered in the design of the equipment is the coordination of signals between chips. In such cases, the use of large scale integrated circuits, such as FPGAs, may not be appropriate. For this purpose, matching chips in microminiature packages are widely used. The majority of these chips are inverters or logic elements with a small number of inputs. Wide range of such small-scale integration chips occupy a special niche in the market of microelectronics, and in large numbers are manufactured for commercial and industrial applications.
The development of highly reliable equipment for special and space applications with a long service life without repair requires chips of military or space level of quality. During its development and production all electronic components are subjected to additional screening tests. It is a long and costly tests, which are conducted for each batch and each type of chip. Accordingly, the wider range of chips is used in equipment, the greater are the cost of the screening tests. At the same time, the need for small-scale integration chips is usually small (units or tens of units), but their diversity may be significant.
These factors indicate the need to create functionally flexible, versatile chips, which would be capable to perform the functions of the small-scale integration chips and would have the high reliability for use in equipment for space applications.
MULTIFUNCTION SMALL-SCALE INTEGRATION CHIPS
SMC "Technological Centre" has developed on the basis of lower type of 5529 gate array two multifunctional digital circuits – 5529ТР015-674 and 5529ТР015-675, which are intended for equipment for space applications and can replace most types of small-scale integration chips.
When designing circuits, it was necessary to reach a compromise between functional flexibility and ease of implementation. The selection of the function is implemented by means of decoding of its address, which is set by the connection of specific external pins of the chip to "power" or "ground". Block diagram of multifunction chip is shown in Fig.1. Address of the configured function is transferred to the decoder of function selection. The outputs of the decoder multiplex the inputs and outputs of the chip to the unit that implements the corresponding function. This method is quite simple and secure as it doesn't use memory cells for configuring ship. The number of possible functions realizable with this method of configuration is equal to 2N, where N is the number of address pins that provides enough functional flexibility. Small size, reliability and resistance to influence of special factors are important characteristics of the chips of this family.
To determine the set of features planned for implementation in 5529ТР015-674 chip, the analysis of 54 (74), 4000 families and domestic small-scale integration chips was carried out. The most popular functions were selected based on the results of the analysis. 5529ТР015-674 multifunction digital sequential logic chip has eight data outputs, ten information and seven address inputs and implements 124 functions of the following types:
• logic elements and splitters;
• digital comparators;
• encoders;
• decoders;
• multiplexers;
• adders;
• composers;
• RS, D and JK flip-flops;
• registers;
• shift registers;
• Johnson counters;
• binary and binary-decimal counters.
Some chips of 74 family that have functions implemented in 5529ТР015-674 chip are presented in the table.
Multifunction digital chip 5529ТР015-675 511 implements 511 different combinational logic functions, has eight information outputs and also eight information and nine address inputs. The chip contains all the possible logic functions with two and three input variables, and potentially the most common functions with more variables [1]. Eight different matching functions are defined in one function for greater flexibility of the chip. The example below shows the logical functions that correspond to the configuration address "054" (a graphical image shown in Fig.2):
CHIPS OF LVDS/LVDM TRANSMITTERS AND RECEIVERS
In addition to a multifunction chips, SMC "Technological Centre" has also developed a series of chips of receivers and transmitters for LVDS and LVDМ standards of low-voltage differential signaling [2].
5529ТР015-688 and 5529ТР015-698 chips contains eight LVDS and eight LVDM transmitters, respectively. Their functional diagram is shown in Fig.3.
5529ТР015-689 chip contains
four LVDS transmitters and four
LVDS/LVDM receivers; 5529ТР015-699 chip – four LVDM transmitters and four LVDS/LVDM receivers. Functional diagram of 5529ТР015-698 and 5529ТР015-699 chips is shown in Fig.4.
5529ТР015-697 chip contains eight LVDS/LVDM receivers. Its functional diagram is shown in Fig.5.
5529ТР015-695 chip contains four M-LVDS half-duplex transceivers. Functional diagram of 5529ТР015-695 chip is shown in Fig.6.
5529ТР015-696 chip is a switch of two two-digit buses of LVDS/LVDM differential lines. This chip has a special input for control of the power of differential outputs, which allows to choose the mode that meets the standards LVDS or LVDM. Functional diagram of 5529ТР015-696 chip is shown in Fig.7.
Full detailed description of 5529 gate array and chips presented in this article is given in the book [3]. ■
This paper was created with the financial support of the Ministry of Education and Science of the Russian Federation. Unique identifier RFMEFI57815X0104.
A problem often encountered in the design of the equipment is the coordination of signals between chips. In such cases, the use of large scale integrated circuits, such as FPGAs, may not be appropriate. For this purpose, matching chips in microminiature packages are widely used. The majority of these chips are inverters or logic elements with a small number of inputs. Wide range of such small-scale integration chips occupy a special niche in the market of microelectronics, and in large numbers are manufactured for commercial and industrial applications.
The development of highly reliable equipment for special and space applications with a long service life without repair requires chips of military or space level of quality. During its development and production all electronic components are subjected to additional screening tests. It is a long and costly tests, which are conducted for each batch and each type of chip. Accordingly, the wider range of chips is used in equipment, the greater are the cost of the screening tests. At the same time, the need for small-scale integration chips is usually small (units or tens of units), but their diversity may be significant.
These factors indicate the need to create functionally flexible, versatile chips, which would be capable to perform the functions of the small-scale integration chips and would have the high reliability for use in equipment for space applications.
MULTIFUNCTION SMALL-SCALE INTEGRATION CHIPS
SMC "Technological Centre" has developed on the basis of lower type of 5529 gate array two multifunctional digital circuits – 5529ТР015-674 and 5529ТР015-675, which are intended for equipment for space applications and can replace most types of small-scale integration chips.
When designing circuits, it was necessary to reach a compromise between functional flexibility and ease of implementation. The selection of the function is implemented by means of decoding of its address, which is set by the connection of specific external pins of the chip to "power" or "ground". Block diagram of multifunction chip is shown in Fig.1. Address of the configured function is transferred to the decoder of function selection. The outputs of the decoder multiplex the inputs and outputs of the chip to the unit that implements the corresponding function. This method is quite simple and secure as it doesn't use memory cells for configuring ship. The number of possible functions realizable with this method of configuration is equal to 2N, where N is the number of address pins that provides enough functional flexibility. Small size, reliability and resistance to influence of special factors are important characteristics of the chips of this family.
To determine the set of features planned for implementation in 5529ТР015-674 chip, the analysis of 54 (74), 4000 families and domestic small-scale integration chips was carried out. The most popular functions were selected based on the results of the analysis. 5529ТР015-674 multifunction digital sequential logic chip has eight data outputs, ten information and seven address inputs and implements 124 functions of the following types:
• logic elements and splitters;
• digital comparators;
• encoders;
• decoders;
• multiplexers;
• adders;
• composers;
• RS, D and JK flip-flops;
• registers;
• shift registers;
• Johnson counters;
• binary and binary-decimal counters.
Some chips of 74 family that have functions implemented in 5529ТР015-674 chip are presented in the table.
Multifunction digital chip 5529ТР015-675 511 implements 511 different combinational logic functions, has eight information outputs and also eight information and nine address inputs. The chip contains all the possible logic functions with two and three input variables, and potentially the most common functions with more variables [1]. Eight different matching functions are defined in one function for greater flexibility of the chip. The example below shows the logical functions that correspond to the configuration address "054" (a graphical image shown in Fig.2):
CHIPS OF LVDS/LVDM TRANSMITTERS AND RECEIVERS
In addition to a multifunction chips, SMC "Technological Centre" has also developed a series of chips of receivers and transmitters for LVDS and LVDМ standards of low-voltage differential signaling [2].
5529ТР015-688 and 5529ТР015-698 chips contains eight LVDS and eight LVDM transmitters, respectively. Their functional diagram is shown in Fig.3.
5529ТР015-689 chip contains
four LVDS transmitters and four
LVDS/LVDM receivers; 5529ТР015-699 chip – four LVDM transmitters and four LVDS/LVDM receivers. Functional diagram of 5529ТР015-698 and 5529ТР015-699 chips is shown in Fig.4.
5529ТР015-697 chip contains eight LVDS/LVDM receivers. Its functional diagram is shown in Fig.5.
5529ТР015-695 chip contains four M-LVDS half-duplex transceivers. Functional diagram of 5529ТР015-695 chip is shown in Fig.6.
5529ТР015-696 chip is a switch of two two-digit buses of LVDS/LVDM differential lines. This chip has a special input for control of the power of differential outputs, which allows to choose the mode that meets the standards LVDS or LVDM. Functional diagram of 5529ТР015-696 chip is shown in Fig.7.
Full detailed description of 5529 gate array and chips presented in this article is given in the book [3]. ■
This paper was created with the financial support of the Ministry of Education and Science of the Russian Federation. Unique identifier RFMEFI57815X0104.
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