rus
With the suspension of the SEMICON Russia, the place in the calendar of events devoted to the semiconductor industry and nanoindustry did not remain free. On June 7–8, the SEMIEXPO Russia 2017 exhibition and conference was held in Moscow’s Expocentre, which was supported by the Department of Radioelectronic Industry of the Ministry of Industry and Trade of the Russian Federation.
The SEMIEXPO was attended by more than 90 companies representing all segments of the semiconductor industry and a number of related industries.
One of the central places of the exposition was occupied by the Deaxo engineering company from Germany, which entered the Russian market in 2015. Deaxo creates turnkey productions in microelectronics, pharmaceuticals and other high-tech industries. The company performs design, installation, commissioning, as well as further technical support of engineering systems and the connection of process equipment. In Russia, Deaxo has offices in Zelenograd and iLand technopark with about 30 employees. Several projects have already been implemented, aimed at developing of domestic electronics and photonics, in particular, NeoPhotonics, Crocus Nanoelectronics and INME RAS are among the company's customers. According to the director, Renй Chalmakoff, the minimization of customer costs and his support throughout the project cycle are special features of the Deaxo's business philosophy. "Before starting the implementation of the project, we are developing and proposing for the client's consideration an optimization plan aimed at reducing the time and costs," Mr. Kalmakoff said. "Supporting the customer throughout the entire project cycle, we not only ensure his high loyalty, but also acquire a new unique experience that contributes to improving the quality of our work in the future. In Russia, we have the opportunity to implement large, complex projects, and this additionally motivates. Our competencies enabled us to implement a project in the INME RAS on the "fast-track" principle, when clean rooms with all the necessary engineering infrastructure for the new pilot production were completely built and put into operation within six months. Russian customers appreciate the fact that we strictly fulfill our promises, and their feedback about our work is the best advertisement for Deaxo".
MINATEH has presented the process and analytical equipment for production and research. A new partner of MINATEH is the German SURAGUS, which develops contactless metrological solutions based on high-frequency eddy current inspection. Compared with conventional contact systems, SURAGUS' technologies provide a significant increase in reliability and speed of measurement. At present, devices are proposed for testing the surface resistance of films and measuring the thickness of metal layers on various materials, including metallic thin films (Al, Mo, Zn, Ag) and functional transparent layers on glass and foil. Solutions have been created for measurements both at one point and across the entire surface of the sample, including in the on-line production mode. According to Sergey Verzhbitsky, General Director of MINATEH, SURAGUS equipment is successfully used both in production and research of semiconductor devices, as well as in photovoltaics and photonics, for example, in the production of smart glass of various types.
Another innovative development, which is available to Russian customers thanks to MINATEH, is the DWL 66+ maskless laser lithography system by the Heidelberg Instruments Mikrotechnik (Germany). Thanks to the HiRes high-resolution exposure mode, for the first time in laser lithography, it is possible to obtain elements with a minimum structure size of 300 nm. In addition, the speed of some operating modes was significantly increased and it became possible to install up to two cassette units in the system.
Maicom Quarz, a company specializing in the engineering of high-tech projects and the supply of equipment, has presented its new partner, Hдcker Automation (Germany), at the exhibition, which produces systems for packaging of electronic devices. A distinctive feature of the Hдcker Automation equipment is the modular design, which allows extremely flexible configuration of the systems in accordance with the user's tasks. The range of solutions includes, among others, modules for 3D micro assembly.
ZENCO PLASMA has focused attention of visitors on the new development of Plasma-Therm, Odyssey HDRF system that is designed for photoresist stripping, stripping of polymers after reactive ion etching, cleaning and smoothing of the side walls of the grooves after the Bosch process, removing of organics in complex 3D structures. Patented HDRF (High Density Radical Flux) technology completely eliminates the ionic component of the etching process. Odyssey HDRF provides high smoothness of the relief and high-precision formation of elements with a high aspect ratio. The machine can be equipped with manual or automatic loading of wafers with a diameter of up to 200 mm.
A unique and possibly revolutionary development of Plasma-Therm is the use of plasma etching for chip dicing, which has become a good alternative to mechanical and laser technologies. The Plasma-Therm MicroDieSingulator allows you to dice chips of different sizes and shapes in a high-speed and accurate manner, reducing the cost of materials, which is especially effective when manufacturing small series of devices.
SVCS from the Czech Republic, a manufacturer of furnaces for the semiconductor industry and photovoltaics, as well as a developer of high-purity gas supply systems, announced a joint project with the ISAC Research (Korea) in the field of development of atomic-layer deposition systems.
On the booth of the GURVIN, the Carl Zeiss microscopes were demonstrated. The specialists of the Russian company noted good prospects for expanding the application of optical and electronic microscopes of the famous German brand in the domestic microelectronics. Important prerequisites for this are the high quality and wide range of Carl Zeiss microscopes, as well as the willingness of the company and its Russian representatives to offer non-standard solutions. Of particular interest at the exhibition was the ZEISS Smartproof 5 scanning confocal microscope with an LED source that provides a spatial resolution of 130 nm. Using the LED instead of the laser provided a significant reduction in the price of the device.
ELINT SP has presented information on ASML's lithography equipment, the leader in this segment of the market, LAM Research's plasma etching and cleaning systems, KMG Ultra Pure Chemicals' consumables that are used by Intel and other leading manufacturers of electronic devices (among Russian users are Mikron and Angstrem-T), Tempress furnaces, which are widely used in the manufacture of solutions for photovoltaics.
SYSTEMA NPK from Zelenograd demonstrated at its booth the Dilase laser lithography equipment and UV-Kub exposing units manufactured by Kloe (France). Dilase systems are particularly effective in small-scale production. They are used in various fields, in particular, in the manufacture of microfluidics devices. UV-Kub systems are characterized by high collimation of the light flux, thus minimizing distortions during exposure. In addition to equipment, Kloe develops photoresists, including biocompatible ones.
Advanced Epi (UK) has presented a unique technology for growing silicon carbide on a silicon substrate. Advantages of silicon carbide are well known: a wide conduction band, resistance to high temperatures, radiation and chemicals, as well as biological inertness. This material is used in the production of power electronics, optoelectronics, sensors, has good prospects in medicine. However, its use was largely hampered by the inability to use traditional epitaxy to grow a layer of silicon carbide on a silicon wafer due to deformation of the latter. Advanced Epi has developed an effective solution to this problem. 100 and 150 mm wafers are already available for ordering, and the company plans to master the production of large-size wafers.
S3 Alliance has presented the metrological equipment of Microsense and Acoulab for measuring the geometry of the wafers, as well as the process equipment of Axus Technology (remanufactured machining equipment), GNP Technology (machining equipment), Trion Technology (plasma etching and deposition systems), Tango Systems (vacuum deposition systems), etc. According to Oleg Vyshkvarkov, General Director of the Russian representative office of the company, the product portfolio offered to Russian customers includes about 300 items.
Chimmed has presented photoresists, polishing suspensions, high-purity chemicals and other consumables for microelectronics made by Entegris, Brewer science, BASF, Henkel and others. Chimmed cooperates with the Mikron, Crocus Nanoelectronics and other enterprises of semiconductor industry. Among the tendencies of the Russian market, the company's specialists noted the growing interest in materials for semiconductor production and nanoindustry from East Asia, in particular, from South Korea and China. This is caused, on the one hand, by the sanctions imposed by the US and EU on Russian enterprises, on the other hand by the development of technologies in East Asia, as a result of which the quality of Korean and Chinese materials has reached the world level while maintaining more favorable prices in comparison with the products of European and North American companies.
Technological Centre SMC from Zelenograd demonstrated a wide range of sensors of physical quantities and sensitive elements, in particular, the matrix of integrated pressure transducers, the digital linear set of the X-ray detector, the three-coordinated magnetoresistive sensor, the transceiver module for the frequency bands 130, 435 and 920 MHz, a range of pressure transducers for absolute, excess and differential pressures, a micro-system for analyzing weak magnetic fields on the basis of a chip with a magnetoresistive sensitive element, which is packaged in a non-magnetic cermet casing. Also, the Technological Centre has presented a family of gate arrays 5529ТН, made by 0.25 µm CMOS-technology on SOI structures, and 5521 made by 0.18 µm process on bulk silicon with ring transistors. ■
One of the central places of the exposition was occupied by the Deaxo engineering company from Germany, which entered the Russian market in 2015. Deaxo creates turnkey productions in microelectronics, pharmaceuticals and other high-tech industries. The company performs design, installation, commissioning, as well as further technical support of engineering systems and the connection of process equipment. In Russia, Deaxo has offices in Zelenograd and iLand technopark with about 30 employees. Several projects have already been implemented, aimed at developing of domestic electronics and photonics, in particular, NeoPhotonics, Crocus Nanoelectronics and INME RAS are among the company's customers. According to the director, Renй Chalmakoff, the minimization of customer costs and his support throughout the project cycle are special features of the Deaxo's business philosophy. "Before starting the implementation of the project, we are developing and proposing for the client's consideration an optimization plan aimed at reducing the time and costs," Mr. Kalmakoff said. "Supporting the customer throughout the entire project cycle, we not only ensure his high loyalty, but also acquire a new unique experience that contributes to improving the quality of our work in the future. In Russia, we have the opportunity to implement large, complex projects, and this additionally motivates. Our competencies enabled us to implement a project in the INME RAS on the "fast-track" principle, when clean rooms with all the necessary engineering infrastructure for the new pilot production were completely built and put into operation within six months. Russian customers appreciate the fact that we strictly fulfill our promises, and their feedback about our work is the best advertisement for Deaxo".
MINATEH has presented the process and analytical equipment for production and research. A new partner of MINATEH is the German SURAGUS, which develops contactless metrological solutions based on high-frequency eddy current inspection. Compared with conventional contact systems, SURAGUS' technologies provide a significant increase in reliability and speed of measurement. At present, devices are proposed for testing the surface resistance of films and measuring the thickness of metal layers on various materials, including metallic thin films (Al, Mo, Zn, Ag) and functional transparent layers on glass and foil. Solutions have been created for measurements both at one point and across the entire surface of the sample, including in the on-line production mode. According to Sergey Verzhbitsky, General Director of MINATEH, SURAGUS equipment is successfully used both in production and research of semiconductor devices, as well as in photovoltaics and photonics, for example, in the production of smart glass of various types.
Another innovative development, which is available to Russian customers thanks to MINATEH, is the DWL 66+ maskless laser lithography system by the Heidelberg Instruments Mikrotechnik (Germany). Thanks to the HiRes high-resolution exposure mode, for the first time in laser lithography, it is possible to obtain elements with a minimum structure size of 300 nm. In addition, the speed of some operating modes was significantly increased and it became possible to install up to two cassette units in the system.
Maicom Quarz, a company specializing in the engineering of high-tech projects and the supply of equipment, has presented its new partner, Hдcker Automation (Germany), at the exhibition, which produces systems for packaging of electronic devices. A distinctive feature of the Hдcker Automation equipment is the modular design, which allows extremely flexible configuration of the systems in accordance with the user's tasks. The range of solutions includes, among others, modules for 3D micro assembly.
ZENCO PLASMA has focused attention of visitors on the new development of Plasma-Therm, Odyssey HDRF system that is designed for photoresist stripping, stripping of polymers after reactive ion etching, cleaning and smoothing of the side walls of the grooves after the Bosch process, removing of organics in complex 3D structures. Patented HDRF (High Density Radical Flux) technology completely eliminates the ionic component of the etching process. Odyssey HDRF provides high smoothness of the relief and high-precision formation of elements with a high aspect ratio. The machine can be equipped with manual or automatic loading of wafers with a diameter of up to 200 mm.
A unique and possibly revolutionary development of Plasma-Therm is the use of plasma etching for chip dicing, which has become a good alternative to mechanical and laser technologies. The Plasma-Therm MicroDieSingulator allows you to dice chips of different sizes and shapes in a high-speed and accurate manner, reducing the cost of materials, which is especially effective when manufacturing small series of devices.
SVCS from the Czech Republic, a manufacturer of furnaces for the semiconductor industry and photovoltaics, as well as a developer of high-purity gas supply systems, announced a joint project with the ISAC Research (Korea) in the field of development of atomic-layer deposition systems.
On the booth of the GURVIN, the Carl Zeiss microscopes were demonstrated. The specialists of the Russian company noted good prospects for expanding the application of optical and electronic microscopes of the famous German brand in the domestic microelectronics. Important prerequisites for this are the high quality and wide range of Carl Zeiss microscopes, as well as the willingness of the company and its Russian representatives to offer non-standard solutions. Of particular interest at the exhibition was the ZEISS Smartproof 5 scanning confocal microscope with an LED source that provides a spatial resolution of 130 nm. Using the LED instead of the laser provided a significant reduction in the price of the device.
ELINT SP has presented information on ASML's lithography equipment, the leader in this segment of the market, LAM Research's plasma etching and cleaning systems, KMG Ultra Pure Chemicals' consumables that are used by Intel and other leading manufacturers of electronic devices (among Russian users are Mikron and Angstrem-T), Tempress furnaces, which are widely used in the manufacture of solutions for photovoltaics.
SYSTEMA NPK from Zelenograd demonstrated at its booth the Dilase laser lithography equipment and UV-Kub exposing units manufactured by Kloe (France). Dilase systems are particularly effective in small-scale production. They are used in various fields, in particular, in the manufacture of microfluidics devices. UV-Kub systems are characterized by high collimation of the light flux, thus minimizing distortions during exposure. In addition to equipment, Kloe develops photoresists, including biocompatible ones.
Advanced Epi (UK) has presented a unique technology for growing silicon carbide on a silicon substrate. Advantages of silicon carbide are well known: a wide conduction band, resistance to high temperatures, radiation and chemicals, as well as biological inertness. This material is used in the production of power electronics, optoelectronics, sensors, has good prospects in medicine. However, its use was largely hampered by the inability to use traditional epitaxy to grow a layer of silicon carbide on a silicon wafer due to deformation of the latter. Advanced Epi has developed an effective solution to this problem. 100 and 150 mm wafers are already available for ordering, and the company plans to master the production of large-size wafers.
S3 Alliance has presented the metrological equipment of Microsense and Acoulab for measuring the geometry of the wafers, as well as the process equipment of Axus Technology (remanufactured machining equipment), GNP Technology (machining equipment), Trion Technology (plasma etching and deposition systems), Tango Systems (vacuum deposition systems), etc. According to Oleg Vyshkvarkov, General Director of the Russian representative office of the company, the product portfolio offered to Russian customers includes about 300 items.
Chimmed has presented photoresists, polishing suspensions, high-purity chemicals and other consumables for microelectronics made by Entegris, Brewer science, BASF, Henkel and others. Chimmed cooperates with the Mikron, Crocus Nanoelectronics and other enterprises of semiconductor industry. Among the tendencies of the Russian market, the company's specialists noted the growing interest in materials for semiconductor production and nanoindustry from East Asia, in particular, from South Korea and China. This is caused, on the one hand, by the sanctions imposed by the US and EU on Russian enterprises, on the other hand by the development of technologies in East Asia, as a result of which the quality of Korean and Chinese materials has reached the world level while maintaining more favorable prices in comparison with the products of European and North American companies.
Technological Centre SMC from Zelenograd demonstrated a wide range of sensors of physical quantities and sensitive elements, in particular, the matrix of integrated pressure transducers, the digital linear set of the X-ray detector, the three-coordinated magnetoresistive sensor, the transceiver module for the frequency bands 130, 435 and 920 MHz, a range of pressure transducers for absolute, excess and differential pressures, a micro-system for analyzing weak magnetic fields on the basis of a chip with a magnetoresistive sensitive element, which is packaged in a non-magnetic cermet casing. Also, the Technological Centre has presented a family of gate arrays 5529ТН, made by 0.25 µm CMOS-technology on SOI structures, and 5521 made by 0.18 µm process on bulk silicon with ring transistors. ■
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