Special Issue/2019
V. P. Bokarev, G. Ya. Krasnikov, E. S. Gornev
Anisotropy of Crystals Surface Properties and its Role in Microelectronic Technology
Anisotropy of Crystals Surface Properties and its Role in Microelectronic Technology
Anisotropy of the surface energy of crystal materials used in the silicon technology has been calculated with a model of coordination melting. Based on these calculations and some experimental data, anisotropies of electron work function on different faces of Al, Cu, Au, Ni, Ta, Cr, W crystals and their surface melting temperature have been evaluated. The paper highlights the relation between physical-chemical properties of crystallographicaly different metals surfaces of the cubic crystal system and the surface arrangement of atoms in the first coordination spheres.
Anisotropy of the surface energy of crystal materials used in the silicon technology has been calculated with a model of coordination melting. Based on these calculations and some experimental data, anisotropies of electron work function on different faces of Al, Cu, Au, Ni, Ta, Cr, W crystals and their surface melting temperature have been evaluated. The paper highlights the relation between physical-chemical properties of crystallographicaly different metals surfaces of the cubic crystal system and the surface arrangement of atoms in the first coordination spheres.
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