rus
TS_pub
technospheramag
technospheramag
ТЕХНОСФЕРА_РИЦ
Special Issue/2019
P. I. Kozlov, N. A. Nagaev
Trends in the development of metal-ceramic packages: import substitution, tooling, components
Trends in the development of metal-ceramic packages: import substitution, tooling, components
The paper considers tendencies of microelectronics development and formulates requirements to modern metal-ceramic packages. Besides, it presents the experience of the domestic factory in creating modern metal-ceramic packages.
The paper considers tendencies of microelectronics development and formulates requirements to modern metal-ceramic packages. Besides, it presents the experience of the domestic factory in creating modern metal-ceramic packages.
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