rus
TS_pub
technospheramag
technospheramag
ТЕХНОСФЕРА_РИЦ
Special Issue/2019
Yu. M. Moskovskaya
Microelectronic parts’ radiation hardness assurance within fabrication process: guidelines to rational methodical approach selection criteria
Microelectronic parts’ radiation hardness assurance within fabrication process: guidelines to rational methodical approach selection criteria
The approach has been developed for choosing a rational test volume and method to confirm the correspondence of a microelectronic part to the technical requirements, depending on particular radiation hardness category and based on a statistical analysis of radiation-sensitive parameters reserve and range values as well as of technological processes used.
The approach has been developed for choosing a rational test volume and method to confirm the correspondence of a microelectronic part to the technical requirements, depending on particular radiation hardness category and based on a statistical analysis of radiation-sensitive parameters reserve and range values as well as of technological processes used.
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