rus
TS_pub
technospheramag
technospheramag
ТЕХНОСФЕРА_РИЦ
Special Issue/2019
И. В. Кулинич, В. А. Кагадей, Р. Н. Мухтеев
A method of packaging RF MEMs switch on GaAs wafer using a frame system
A method of packaging RF MEMs switch on GaAs wafer using a frame system
The paper studies several methods of packaging the microwave MEMS-switch on a GaAs wafer. The method with a framework system has been chosen. With the help of mathematical modeling, the optimal geometry of the cell of the framework system has been determined, which corresponds to mechanical and hydrodynamic requirements. The technology of packaging has been developed.
The paper studies several methods of packaging the microwave MEMS-switch on a GaAs wafer. The method with a framework system has been chosen. With the help of mathematical modeling, the optimal geometry of the cell of the framework system has been determined, which corresponds to mechanical and hydrodynamic requirements. The technology of packaging has been developed.
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