rus
Special Issue/2019
M. G. Biryukov V. V. Odinokov
Vacuum-plasma processes and experimental equipment for optimizing technologies on O200 mm plates with topological dimensions of 180–65 nanometers level
Vacuum-plasma processes and experimental equipment for optimizing technologies on O200 mm plates with topological dimensions of 180–65 nanometers level
The paper highlights current vacuum-plasma processes and experimental equipment, such as atomic-layer deposition, plasma-chemical etching, shallow trench isolation technique and wafer stripping.
The paper highlights current vacuum-plasma processes and experimental equipment, such as atomic-layer deposition, plasma-chemical etching, shallow trench isolation technique and wafer stripping.
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