rus
TS_pub
technospheramag
technospheramag
ТЕХНОСФЕРА_РИЦ
Special Issue/2019
V. V. Vedeneev A. I. Reshmin S. K. Teplovodskii J. S. Zayko V. V. Trifonov A. V. Markin
Gas-dynamic protection of microelectronics processes and objects from external contamination
Gas-dynamic protection of microelectronics processes and objects from external contamination
The paper considers the technoloy of forming the submerged air jets of circular cross-section remaining unidirectional at the distance equal to 5–6 diameters of the jet at sufficiently high Reynolds numbers (~2000–13000). The efficiency of protection of microelectronic objects in such jets from the environment impact has been shown. The technology developed can be used for creating local clean zones not bounded by rigid walls in microelectronics production.
The paper considers the technoloy of forming the submerged air jets of circular cross-section remaining unidirectional at the distance equal to 5–6 diameters of the jet at sufficiently high Reynolds numbers (~2000–13000). The efficiency of protection of microelectronic objects in such jets from the environment impact has been shown. The technology developed can be used for creating local clean zones not bounded by rigid walls in microelectronics production.
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